PCB development needs-high heat dissipation

In recent years, the focus of the PCB market has shifted computers to communications, including base stations, servers, mobile terminals. Mobile communication devices such as smartphones have driven PCBs to higher density, thinner, higher functionality. Printed circuit technology is inseparable the substrate material, which also involves the technical requirements of the PCB substrate. Let me talk about the PCB board's need for high heat dissipation heat dissipation.

With the miniaturization high function of electronic equipment, high heat generation, the thermal management requirements of electronic equipment are constantly increasing. One of the solutions chosen is the development of thermally conductive printed circuit boards. The primary condition for heat heat dissipation PCB is the heat resistance heat dissipation of the substrate. At present, the resin is improved the filler is added to the substrate to improve the heat resistance heat dissipation to a certain extent, but the thermal conductivity improvement is very limited. Typically, a metal substrate (IMS) metal core printed circuit board is used to dissipate heat the heat-generating component, which reduces the volume costs compared with traditional radiators fan cooling.

Aluminum is a very attractive material. It has abundant resources, low cost, good thermal conductivity strength, is environmentally friendly. At present, most metal substrates metal cores are metal aluminum. The advantages of aluminum-based circuit boards are simple economical, reliable electronic connections, high thermal conductivity strength, no soldering lead-free environmental protection, etc., consumer products to automobiles, military products aerospace can be designed applied. The thermal conductivity heat resistance of metal substrates need be doubted. The key lies in the performance of the insulating adhesive between the metal plate the circuit layer.

At present, the driving force of thermal management is focused on LEDs. Nearly 80% of the input power of LEDs is converted into heat. Therefore, the thermal management of LEDs has received great attention, the focus is on the heat dissipation of the LED substrate. The composition of high heat-resistant environmentally-friendly heat-dissipating insulation material lays the foundation for cutting into the high-brightness LED lighting market. Circuit board manufacturer

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