Brief history development direction of PCB

A brief history of development: China began the development of single-sided printed boards the mid-fifties, first applied to semiconductor radios. In the 1960s, we independently developed our country's foil-clad substrates, making the copper foil etching method the dominant process in China's PCB production, in the 1960s, we were able to produce single panels in large quantities. Small-scale production of double-sided metallized hole printing, development of multilayer boards in a few units. In the 1970s, the graphic plating etching process was promoted in China, but due to various interferences, the special materials equipment for printed circuits did keep up with the time, the entire production technology level lags behind foreign advanced levels. In the 1980s, due to the introduction of the reform opening-up policy, only a large number of single-sided, double-sided, multi-layer printed board production lines with advanced levels abroad in the 1980s were introduced, but after more than a decade of digestion absorption, it has been rapidly improved. China's printed circuit production technology level.

Development direction: In recent years, China's electronics industry has become one of the main pillars driving domestic economic growth. With the rapid development of the computer, communications equipment, consumer electronics automotive industries, the PCB industry has also achieved rapid development. With the development of printed circuit products, new materials, new process technologies new equipment are required. While expanding the output of China's printed electrical materials industry, we must pay more attention to improving performance quality; the printed circuit special equipment industry is no longer a low-level counterfeit, but is developing towards production automation, precision, multi-function modern equipment . PCB production integrates the world's high-tech technology. Printed circuit production technology will use liquid photoimaging, direct plating, pulse plating, laminated multilayer boards other new processes. pcb customization

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